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Digital mold texturizing methods, materials, and substrates
Digital mold texturizing methods, materials, and substrates
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机译:数字化模具纹理化方法,材料和基材
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摘要
A multi-layer ink receptive substrate is described. The ink-receptive substrate can comprise a micro-porous ink receptive layer, a degradable binder layer and a carrier layer. The degradable binder layer is positioned intermediate the micro- porous ink receptive layer and the insoluble carrier layer. A method of forming an acid-resist pattern using such a substrate is also described. The method comprises depositing an acid-resistant ink jetted UV-curable material onto the multi-layer ink receptive substrate. at least partially curing the acid-resistant ink jetted UV-curable material and transferring the acid-resistant ink jetted UV-cured material to a substrate to be etched.
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