High-power semiconductor module with a sandwich with a high-power semiconductor component

摘要

the invention describes a leistungshalbleitermodul with at least a first and a second lastanschlussku00f6rper, with at least one between these lastanschlussku00f6rpern ordered sandwich with a first metallformku00f6rper,a leistungshalbleiterbauelement and a second metallformku00f6rper are components of the sandwiches stoffschlu00fcssig connected to each other and a periphery of the leistungshalbleiterbauelements is surrounded by an electrically insulating, high wu00e4rmeleitfu00e4higen polymermaterial.it is important that this polymermaterial in thermal contact with at least one leading to the first or second metallformku00f6rper.