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Mems device having support structures configured to minimize stress-related deformation and methods for fabricating same
Mems device having support structures configured to minimize stress-related deformation and methods for fabricating same
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机译:具有被配置为最小化与应力有关的变形的支撑结构的记忆装置及其制造方法
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摘要
Embodiments of MEMS devices include a movable layer supported by overlying support structures, and may also include underlying support structures. In one embodiment, the residual stresses within the overlying support structures and the movable layer are substantially equal. In another embodiment, the residual stresses within the overlying support structures and the underlying support structures are substantially equal. In certain embodiments, substantially equal residual stresses are obtained through the use of layers made from the same materials having the same thicknesses. In further embodiments, substantially equal residual stresses are obtained through the use of support structures and/or movable layers which are mirror images of one another.
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