METHOD FOR PROCESSING A SEMICONDUCTOR PACKAGE CAPABLE OF PROCESSING A VIA HOLE BY IRRADIATING A LASER BEAM IN THE MOLD PART OF THE SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A method for processing a semiconductor package is provided to improve productivity and working efficiency by irradiating a laser beam on a location which is corresponded to each solder ball pad along a spiral locus.;CONSTITUTION: One of a plurality of spiral locus patterns, which is saved in the controller of a laser beam irradiating apparatus, is selected. A spiral locus is generated by inputting data about a selected spiral locus pattern. A laser beam irradiation condition is inputted for a generated spiral locus. A laser beam is irradiated on a location which is corresponded to each solder ball pad along the spiral locus.;COPYRIGHT KIPO 2012