FLIP CHIP BONDING METHOD WHICH USES AN ADHESIVE LAYER INCLUDING A THERMO-REVERSIBLE RESIN CAPABLE OF PRINTING THE ADHESIVE LAYER ON A SUBSTRATE IN BEFOREHAND

摘要

PURPOSE: A flip chip bonding method which uses an adhesive layer including a thermo-reversible resin is provided to not use a solvent in a printing process of the adhesive layer on a substrate, thereby preventing air gap generation in the adhesive layer.;CONSTITUTION: A mixture in a liquid state is acquired by mixing a hardener and catalyst into a liquid state resin(S10). The shape of the liquid state resin is reversibly changed by heat. The mixture is liquidized by heating when a solidification process of the mixture is proceeded(S15). An adhesive layer is arranged by printing the mixture of the liquid state on a substrate(S20). The adhesive layer is solidified to a solid state(S30). A chip is welded on the substrate by applying heat and pressure(S40).;COPYRIGHT KIPO 2012