METHOD FOR CRYSTALLIZATION OF A SILICON LAYER CAPABLE OF IMPROVING THE LEAKAGE CURRENT CHARACTERISTIC OF A DEVICE AND A METHOD FOR FORMING A FILM TRANSISTOR USING THE METHOD FOR CRYSTALLIZATION

摘要

PURPOSE: A method for crystallization of a silicon layer and a method for forming a thin film transistor using the method for crystallization are provided to steadily form catalyst metal of a trace amount by changing the surface of an amorphous silicon layer into hydrophobic.;CONSTITUTION: An amorphous silicon layer is formed on substrate(S110). The surface of the amorphous silicon is executed a hydrophobic treatment. A catalyst metal is formed on the amorphous silicon layer(S130). The amorphous silicon layer which forms the catalyst metal is crystallized to a polycrystalline silicon layer by a thermal process(S140). The hydrophobic treatment is processed using solution which contains hydrogen or fluorine. A gate insulating layer is formed on the polycrystalline silicon layer and a gate electrode is formed on the gate insulating layer. A source/drain domain is formed in both sides of the gate electrode. An inter layer insulating layer is formed on the gate insulating layer and the gate electrode. A source/drain electrode touches with the source/drain domain by passing through the inter layer insulating layer.;COPYRIGHT KIPO 2012