SUBSTRATE DICING METHOD BY NANO VOID ARRAY FORMATION USING FEMTOSECOND PULSE LASERS

摘要

PURPOSE: A method for cutting for nano-void array forming by femtosecond laser is provided to improve the cutting and processing efficiency of a transparent material by forming nano-void array using femtosecond laser. CONSTITUTION: A method for cutting for nano-void array forming by femtosecond laser comprises next steps. A pole first grade femtosecond laser is condensed to a condensing lens(120) and radiates laser beam to a transparent material or substrate. The plasma defocusing is performed by multi-photon ionization. Self focusing is performed due by Kerr Lens. Nano-Void Array(210) is formed on a substrate and cut. The energy per pulse has the energy value on the substrate in order to become over the threshold energy 0.2uJ for the void formation.