A METHOD FOR MANUFACTURING A FLEXIBLE COPPER CLAD LAMINATE WITH EXCELLENT CRACK RESISTANCE

摘要

A method for manufacturing flexible copper-clad laminates with excellent flex resistance is provided to improve flex resistance by forming a copper-plating layer on a polymer film. A base film is surface-treated. A copper foil is deposited on the surface-treated base film. The base film on which the copper foil is deposited is electroplated to form a copper-plating layer on the copper foil. A copper electroplating solution contains 1~4ml/L of polish and 10~40ml/L of leveler. Applied current is successively increased from at least 1A/dm^2 to maximumly 5A/dm^2. The base film represents a polyimide film. The copper foil is formed on a polymer film through a sputtering method. The manufactured flexible copper-clad laminates shows excellent flex resistance. The surface treatment is performed by oxygen ion beams. The polish indicates an alkylsulfonate-based compound. The deposited copper foil has 1000~6000Å of thickness.