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METHOD FOR DETECTING DEFECTS ON A BALL-JUNCTION OF THREE-DIMENSIONAL IMAGE BASE BGA CHIP
METHOD FOR DETECTING DEFECTS ON A BALL-JUNCTION OF THREE-DIMENSIONAL IMAGE BASE BGA CHIP
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机译:检测基于三维图像的BGA芯片的球结缺陷的方法
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摘要
PURPOSE: A method for detecting defects on a ball-junction of three-dimensional image base BGA chip is provided to automatically detect a volume and shape of a ball by analyzing the three-dimensional image base BGA chip.;CONSTITUTION: A method for detecting defects on a ball-junction of three-dimensional image base BGA chip is as follows. The three-dimensional image toward the junction position looked at of the BGA chip is obtained(S210). The first information including location, area and volume of the checking object ball is obtained(S230). Volume defects of each balls are distinguished based on the first information(S240). The pixel corresponding to the surface of each balls is extracted. The curvature value of the target time point is calculated based on the extracted each pixel. The defects on a ball-junction of three-dimensional image base are detected based on the calculated curvature value(S250).;COPYRIGHT KIPO 2012
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