首页> 外国专利> METHOD FOR DETECTING DEFECTS ON A BALL-JUNCTION OF THREE-DIMENSIONAL IMAGE BASE BGA CHIP

METHOD FOR DETECTING DEFECTS ON A BALL-JUNCTION OF THREE-DIMENSIONAL IMAGE BASE BGA CHIP

机译:检测基于三维图像的BGA芯片的球结缺陷的方法

摘要

PURPOSE: A method for detecting defects on a ball-junction of three-dimensional image base BGA chip is provided to automatically detect a volume and shape of a ball by analyzing the three-dimensional image base BGA chip.;CONSTITUTION: A method for detecting defects on a ball-junction of three-dimensional image base BGA chip is as follows. The three-dimensional image toward the junction position looked at of the BGA chip is obtained(S210). The first information including location, area and volume of the checking object ball is obtained(S230). Volume defects of each balls are distinguished based on the first information(S240). The pixel corresponding to the surface of each balls is extracted. The curvature value of the target time point is calculated based on the extracted each pixel. The defects on a ball-junction of three-dimensional image base are detected based on the calculated curvature value(S250).;COPYRIGHT KIPO 2012
机译:目的:提供一种用于检测三维图像基BGA芯片的球结处缺陷的方法,以通过分析三维图像基BGA芯片来自动检测球的体积和形状。三维图像基BGA芯片的球形结上的缺陷如下。获得朝向BGA芯片观察的接合位置的三维图像(S210)。获得包括检查对象球的位置,面积和体积的第一信息(S230)。基于第一信息来区分每个球的体积缺陷(S240)。提取与每个球的表面相对应的像素。基于所提取的每个像素来计算目标时间点的曲率值。根据计算出的曲率值检测三维图像球形结点上的缺陷(S250)。;COPYRIGHT KIPO 2012

著录项

  • 公开/公告号KR101094412B1

    专利类型

  • 公开/公告日2011-12-15

    原文格式PDF

  • 申请/专利权人 3D INDUSTRIAL IMAGING CO. LTD.;

    申请/专利号KR20110048540

  • 发明设计人 YOON JUN HYUK;KIM KYU NYUN;

    申请日2011-05-23

  • 分类号G01B11/24;G06T7/60;G01N21/88;

  • 国家 KR

  • 入库时间 2022-08-21 17:11:01

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