首页> 外国专利> A UNIT PICTURE ELEMENT INCLUDING A PHOTODIODE INCLUDING A LIGHT ANTI-ABSORPTION LAYER FORMED THEREON, BACK-SIDE ILLUMINATION CMOS IMAGE SENSOR INCLUDING THE UNIT PICTURE ELEMENT

A UNIT PICTURE ELEMENT INCLUDING A PHOTODIODE INCLUDING A LIGHT ANTI-ABSORPTION LAYER FORMED THEREON, BACK-SIDE ILLUMINATION CMOS IMAGE SENSOR INCLUDING THE UNIT PICTURE ELEMENT

机译:包含光电二极管的光电二极管元件,其上形成有光吸收层,背面照明CMOS图像传感器,包含光电二极管元件

摘要

PURPOSE: A unit pixel and a backside illumination complementary metal oxide semiconductor image sensor including the same are provided to an improve trade off relation of sensitivity about white spot and light. CONSTITUTION: A photo diode(120) is formed on the upper side of a wiring layer(110). An optical absorption blocking layer(130) is formed on the upper side of the photo diode. An anti-reflection layer(140) is formed on the upper side of the optical absorption blocking layer. A color filter(150) is formed on the upper side of the anti-reflection layer. A micro lens(160) is formed on the upper side of the color filter. The anti-reflection layer is formed into a compound semiconductor in which energy band gap is bigger than a semiconductor which constitutes the photo diode. A visible ray passes through the compound semiconductor.
机译:目的:提供单位像素和包括该单位像素的背面照明互补金属氧化物半导体图像传感器,以改善关于白点和光的感光度的权衡关系。组成:一个光电二极管(120)形成在布线层(110)的上侧。光吸收阻挡层(130)形成在光电二极管的上侧。在光吸收阻挡层的上侧形成抗反射层(140)。滤色器(150)形成在抗反射层的上侧。在滤色器的上侧形成有微透镜(160)。防反射层形成为能带隙大于构成光电二极管的半导体的化合物半导体。可见光线穿过化合物半导体。

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