PURPOSE: A printed circuit board and a manufacturing method thereof are provided to achieve the stiffness of a printed circuit board by obtaining the thickness of an insulating layer as much as that of a circuit pattern which is inserted to the inside. CONSTITUTION: An external circuit pattern(171) is formed in the surface of a first insulating layer(150). An internal circuit pattern is formed into a buried structure in the surface inner side of the other side of the first insulating layer. A metal bump(170) electrically connects an inside circuit pattern and an external circuit pattern. One surface of the internal circuit pattern is exposes to the outside of the insulating layer. The other surface of the internal circuit pattern is formed into a structure which is buried in the insulating layer. A solder resist layer(190) selectively covers up a part of the exposed surface of the internal circuit pattern or the external circuit pattern. The surface processing layer(180) of a single layer or multilayer is formed on the exposed surface of the internal circuit pattern and the outside circuit pattern using one among Cu(Copper), Ni(Nickel), Pd(Palladium), Au(Aurum), Sn(Stannum), Ag(Argentum), and Co(Cobalt), or their binary alloy.
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