首页> 外国专利> TRIMMING METHOD FOR TRIMMING A PROCESSING LAYER OF A DOUBLE-SIDED POLISHING APPARATUS CAPABLE OF SIMULTANEOUSLY PROCESSING BOTH SURFACES OF A FLAT STRUCTURE AND A TRIMMING APPARATUS USING THE SAME

TRIMMING METHOD FOR TRIMMING A PROCESSING LAYER OF A DOUBLE-SIDED POLISHING APPARATUS CAPABLE OF SIMULTANEOUSLY PROCESSING BOTH SURFACES OF A FLAT STRUCTURE AND A TRIMMING APPARATUS USING THE SAME

机译:用于修整可同时处理平整结构表面的双面抛光装置的处理层的修整方法和使用相同方法的修整装置

摘要

PURPOSE: A trimming method for trimming a processing layer of a double-sided polishing apparatus and a trimming apparatus using the same are provided to trim two processing layers applied on mutually facing surfaces of a lower processing disc and an upper processing disc.;CONSTITUTION: A tooth-shape part(10) comprises a trimming main body(8) on a trimming disc(9). The trimming disc is installed on the circumference of the trimming disc. The trimming main body is uniformly arranged on a pitch circle(17) into a concentric shape from the circumference of the trimming disc. The width of a ring is exactly equivalent to the diameter of the trimming main body. The diameter of the trimming main body is smaller than a ring width between an inner envelope curve(18b) and an outer envelope curve(18a).;COPYRIGHT KIPO 2012
机译:目的:提供一种用于修整双面抛光装置的处理层的修整方法和使用该修整方法的修整装置,以修整施加在下处理盘和上处理盘的相对表面上的两个处理层。齿形部分(10)包括在修整盘(9)上的修整主体(8)。修整盘安装在修整盘的圆周上。修整主体从修整盘的圆周均匀地布置在节圆(17)上成同心形状。环的宽度正好等于修整主体的直径。修整主体的直径小于内包络线(18b)和外包络线(18a)之间的环形宽度。; COPYRIGHT KIPO 2012

著录项

  • 公开/公告号KR20120023531A

    专利类型

  • 公开/公告日2012-03-13

    原文格式PDF

  • 申请/专利权人 SILTRONIC AG;

    申请/专利号KR20110074148

  • 发明设计人 PIETSCH GEORG;KERSTAN MICHAEL;

    申请日2011-07-26

  • 分类号H01L21/304;

  • 国家 KR

  • 入库时间 2022-08-21 17:10:26

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