ENVIRONMENT-FRIENDLY WATER-SOLUBLE CUTTING FLUID FOR WAFER, AND COMPOSITION CONTAINING THE SAME CUTTING FLUID

摘要

PURPOSE: Water soluble cutting fluid for cutting wafers, and a water soluble cutting fluid composition containing thereof are provided to reduce the generation of frictional heat during a cutting process for minimizing the deformation of materials. CONSTITUTION: Water soluble cutting fluid for cutting wafers is marked with chemical formula 1. In the chemical formula 1, R1 and R2 are hydrogen or methyl independently. A water soluble cutting fluid composition contains 30-100wt% of water soluble cutting fluid, and an additional material selected from the group consisting of a water-soluble polymer, glycerol, alkylene glycol, alkylene oxide adducts, and water.