METHOD FOR MANUFACTURING A MULTI-LAYERED WIRING SUBSTRATE CAPABLE OF SAVING COSTS REQUIRED FOR MANUFACTURING PROCESSES BASED ON THE MODIFICATION OF STRUCTURES

摘要

PURPOSE: A method for manufacturing a multi-layered wiring substrate is provided to obtain the multi-layered wiring substrate based on a lower metal foil and an upper metal foil without an exfoliative copper foil.;CONSTITUTION: An insulating layer fixing process is implemented by following: two metal foils are overlapped and are arranged on a substrate; outer peripheral part of a lower metal foil and an upper metal foil are exposed; and resin-based insulating materials are arranged on the surface of the upper metal foil, and the outer peripheral part of the resin-based insulating material is fixed on the substrate. A stacking process is implemented by following: a plurality of conductive layers and resin insulating layers(21 to 24) is stacked to obtain a stacked structure(60); and a wiring stacked part is formed on the upper metal foil. An eliminating process with respect to a peripheral part is implemented. A separating process separates the substrate and the stacked structure from the metal foils.;COPYRIGHT KIPO 2012