PUNCHING DEVICE AND A METHOD FOR FORMING A HOLE ON A SUBSTRATE BY USING THE SAME CAPABLE OF FORMING A VIA HOLE BY PUNCHING A CUT AREA OF A CIRCUIT TAPE

摘要

PURPOSE: A punching device and a method for forming a hole on a substrate by using the same are provided to reduce punching tool costs by forming a desirable hole using an existing tool without a new punching tool.;CONSTITUTION: A punching die(110) includes a preset groove. A substrate(130) is loaded on the upper side of the groove. A punching tool(120) forms a via hole by cutting the substrate with a punch blade. A storage unit(220) stores a control program(221). An X axis and Y axis transfer unit(210) moves a punching tool or punching head in an X axis and a Y axis. A control unit(230) controls the operation of the X axis and Y axis transfer unit according to a control program.;COPYRIGHT KIPO 2012