SMT SYSTEM AND METHOD FOR PROCCESSING SURFACE-MOUNT TOGETHER WITH UNDER-FILL BY SOLID EPOXY

摘要

PURPOSE: A surface mount system and method for simultaneously processing under-filling along with surface-mounting by providing a solid epoxy in a form of a part are provided to reduce labor force and equipment necessary for an underfilling process since a separate underfilling process is not performed. CONSTITUTION: A substrate supply unit(101) supplies a printed circuit board. A screen printer(102) applies a solder paste on a pattern. A plurality of part supply reel devices(108) supplies parts through a supply reel. A surface mount device(103) mounts a surface mounted part and a solid epoxy on the printed circuit board. A solder inspection(105) inspects the built-in state of parts.