Millimetre-wave MMIC packaging compatible with surface-mount technology (SMT)

摘要

This paper presents an interconnect and packaging solution for millimetre-wave MMIC, based on collective wiring and surface mount technologies. The designed structure consists of an SMT CSP (Chip Scale Package) mounted on printed circuit board (PCB). This packaging concept has been applied to a millimetre-wave LNA and has been measured up to 60 GHz, exhibiting results close to bare die measurements (insertion loss per millimetre-wave transition lower than 0.5dB) and demonstrating the potential of this technology up to V-band.