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LOW LOSS DC TO 50 GHz LTCC SMT PACKAGE FOR MILLIMETER WAVE MMICs

机译:低损耗DC至50 GHz LTCC SMT封装,用于毫米波MMIC

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The new vertical transition using the trough line, the slab line, and shielded multilayer coplanar waveguides (SMCPW) in order to implement the DC~50-GHz band low loss LTCC hermetic surface mounting (SMT) MMIC package was developed. The trough line, the slab line, and the SMCPWs were employed in order to minimize the discontinuity of the conventional via vertical transition, and the radiation loss and crosstalk. The proposed vertical transition is constructed using the multiple transmission lines of the SMCPW1-trough line-slab line-SMCPW2-SMCPW3. The manufactured LTCC hermetic SMT MMIC package showed a low insertion loss less than 0.6 dB and a reflection loss less than -20 dB in the frequency range from DC to 53 GHz.
机译:为了实现DC〜50GHz频带低损耗LTCC密封表面贴装(SMT)MMIC封装,开发了使用槽线,平板线和屏蔽多层共面波导(SMCPW)的新垂直过渡。采用槽线,平板线和SMCPW是为了最大程度地减少常规通孔垂直过渡的不连续性以及辐射损耗和串扰。建议的垂直过渡是使用SMCPW1-槽线-平板线-SMCPW2-SMCPW3的多条传输线构造的。所制造的LTCC密封SMT MMIC封装在DC至53 GHz的频率范围内显示出小于0.6 dB的低插入损耗和小于-20 dB的反射损耗。

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