首页> 外国专利> POLYAMIDE BASED RESIN COMPOSITION WITH EXCELLENT TOUGHNESS, IMPACT RESISTANCE, AND HEAT RESISTANCE, COMPRISING POLYAMIDE BASED RESIN, POLYOLEFIN RESIN, AND PLASTICIZER

POLYAMIDE BASED RESIN COMPOSITION WITH EXCELLENT TOUGHNESS, IMPACT RESISTANCE, AND HEAT RESISTANCE, COMPRISING POLYAMIDE BASED RESIN, POLYOLEFIN RESIN, AND PLASTICIZER

机译:聚酰胺基树脂组合物,具有出色的韧性,耐冲击性和耐热性,包含聚酰胺基树脂,聚烯烃树脂和增塑剂

摘要

PURPOSE: A polyamide based resin composition is provided to have excellent toughness, impact resistance, and heat resistance without using rubber, thereby being applied to products like tube, cable, etc.;CONSTITUTION: A polyamide based resin composition comprises (A) polymide 11 or polyamide 12, (B) polyamide 6, (C) polyolefin resin, and a plasticizer. The amount of the polyolefin resin in a based resin consisting of (A)+(B)+(C) is 0.1-30 weight%, and the amount of the plasticizer is 1-15 parts by weight based on 100.0 parts by weight of the base resin. The melting point of the (A) polyamide 11 or polyamide 12 is 180°C or higher, and the relative viscosity is 2 or higher.;COPYRIGHT KIPO 2012
机译:用途:提供聚酰胺基树脂组合物,具有优异的韧性,耐冲击性和耐热性,而无需使用橡胶,因此可用于管子,电缆等产品;组成:聚酰胺基树脂组合物,包含(A)聚酰胺11或聚酰胺12,(B)聚酰胺6,(C)聚烯烃树脂和增塑剂。基于(A)+(B)+(C)构成的基体树脂中的聚烯烃树脂的量为0.1〜30重量%,增塑剂的量相对于100.0重量份的聚烯烃为1〜15重量份。基础树脂。 (A)聚酰胺11或聚酰胺12的熔点为180℃或更高,并且相对粘度为2或更高。; COPYRIGHT KIPO 2012

著录项

  • 公开/公告号KR20120066102A

    专利类型

  • 公开/公告日2012-06-22

    原文格式PDF

  • 申请/专利权人 CHEIL INDUSTRIES INC.;

    申请/专利号KR20100127277

  • 发明设计人 CHUNG TAEK WOONG;HUH JIN YOUNG;HA DOO HAN;

    申请日2010-12-14

  • 分类号C08L77/00;C08L23/00;C08K5/435;C08J5/00;

  • 国家 KR

  • 入库时间 2022-08-21 17:09:47

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