RESIN COMPOSITION COMPRISING NITRIDE BORON AND ALUMINA WITH LOW THERMAL EXPANSION RATIO, HAVING RELATIVELY LOW HARDNESS, A PREPREG USING THE SAME, AND A PRINTED WIRING PLATE USING THE SAME

摘要

PURPOSE: A resin composition is provided to improve reliability of a semiconductor package by having low thermal expansion coefficient, and excellent drill processability and excellent thermal conductivity because of comprising nitride boron and alumina having low thermal expansion ratio, and high thermal conductivity as an inorganic filler.;CONSTITUTION: A resin composition comprises an epoxy resin having at least two or more epoxy groups in one molecule, one or more curing component selected from a group consisting of curing agent, and curing accelerator, and an inorganic filler. The inorganic filler comprises 100.0 parts by weight of alumina, and 5-50 parts by weight of boron nitride. The alumina has average particle diameter of 0.3-10 micron, and has a spherical shape, a plate-like shape, or a mixed shape thereof. The prepreg is formed by coating or impregnating the resin composition into a fiber substrate.;COPYRIGHT KIPO 2012