METHOD FOR MANUFACTURING A PROXIMITY SENSOR, CAPABLE OF PREVENTING INFRARED RAYS OF AN INFRARED EMITTING DIODE FLOWING INTO THE INSIDE OF A PROXIMITY SENSOR

摘要

PURPOSE: A method for manufacturing a proximity sensor is provided to prevent infrared rays of an infrared emitting diode flowing into the inside of a proximity sensor, thereby improving the malfunction of the proximity sensor.;CONSTITUTION: A method for manufacturing a proximity sensor is as follows. An infrared emitting diode(20) and a light emitting diode(30) are respectively welded in a side and the other side of a top surface of a PCB(Printed Circuit Board)(10). A transmission sealing part(40) is formed in the PCB. The transmission sealing part accommodates the infrared emitting diode and the light emitting diode and a lens unit in one side and the other lens unit in the other side are formed in one side and the other side of the upper part of the transmission sealing part. A horizontal groove(50) being spread from the transmission sealing part to a predetermined length of the PCB by using a cutting tool for partitioning a surface of the PCB into one side and the other side. A bonding layer is formed on the transmission sealing part. A light-shielding sealing material is filled with the horizontal groove and covers a portion except the lens units of one and the other sides of the transmission sealing part so that a light-shielding sealing part(60) is formed.;COPYRIGHT KIPO 2012