BUFFER BOARD CAPABLE OF PREVENTING THE DEFORMATION OF VOLAND, A BUFFER SHEET, AND A MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A buffer board, a buffer sheet, and a manufacturing method thereof are provided to improve manufacture yield of a semiconductor package by preventing the contamination of a mold die.;CONSTITUTION: A first substrate(110) has a one surface and the other surface. A cover film is laminated on the one surface of the substrate. One or more penetration holes are formed on the first substrate. The penetration hole is filled with a first elastic body(130). The first elastic body covers the other surface of the first substrate. The first elastic body comprises silicon rubber, elastomer, or thermoplastic resin. A second substrate is laminated on the other surface of the first substrate while leaving the first elastic body in interval.;COPYRIGHT KIPO 2012