ELECTROPLATING DEVICE AND METHOD FOR IMPLEMENTING PARTIAL PLATING WITHOUT DIPPING AN ELECTRODE IN PLATING SOLUTION

摘要

PURPOSE: An electroplating device and method are provided to continuously partially plate the remaining part of a work piece except a part not dipped in plating solution even without covering a non-plated part of the work piece.;CONSTITUTION: An electroplating device comprises a pair of rails(3), a plating bath, a supply device, and a rod(18). Electrodes(20) are arranged at an interval narrower than the head(b10) of a work piece(b1) and wider than the neck(b03) of the work piece. The plating bath is located under the pair of rails, and an electrode plate is positioned in plating solution of the plating bath. The supply unit locates the necks of the electrodes in the gap between the rails so that the head is located above the pair of rails and a part below the neck is located under the pair of rails. The rod pushes a position under the center of gravity of the work piece through the gap between the rails, thereby sliding the work piece on the pair of rails as being in contact with the electrodes.;COPYRIGHT KIPO 2013