PDMS BONDING APPARATUS AND THE METHOD OF PDMS BONDING USING THE SAME

摘要

PURPOSE: A PDMS(polydimethylsiloxane) bonding device and a PDMS bonding method using the same are provided to eliminate the need for a vacuum chamber by plasma processing PDMS and a substrate under normal pressure, not under vacuum pressure, so that alignment of the PDMS and substrate is maintained. CONSTITUTION: A PDMS bonding device comprises an upper placing mechanism(100), a lower placing mechanism(200), and a plasma processor(300). One surface of PDMS is attached on the upper placing mechanism. The lower placing mechanism holds a substrate(S) bonded to the other surface of the PDMS. The plasma processor enters to the gap between the upper and lower placing mechanisms when the upper and lower placing mechanisms are separated by a predetermined gap, thereby plasma processing the other surface of the PDMS and the substrate.