首页> 外国专利> CYCLIC OLEFIN-BASED RESIN CAPABLE OF FORMING A HIGH HEAT-RESISTANT FILM WITH IMPROVED COEFFICIENT OF THERMAL EXPANSION, HIGH TRANSMITTANCE, THERMAL STABILITY, AND THERMOGRAVIMETRIC ANALYSIS

CYCLIC OLEFIN-BASED RESIN CAPABLE OF FORMING A HIGH HEAT-RESISTANT FILM WITH IMPROVED COEFFICIENT OF THERMAL EXPANSION, HIGH TRANSMITTANCE, THERMAL STABILITY, AND THERMOGRAVIMETRIC ANALYSIS

机译:具有循环烯烃基树脂的能力,可形成高耐热薄膜,并具有提高的热膨胀系数,高透射率,热稳定性和热重分析法

摘要

PURPOSE: A cyclic-olefin-based resin is provided to improve a cross linked degree, and to remarkably improved physical properties including thermal expansion coefficient.;CONSTITUTION: A cyclic olefin-based resin comprises polynorbornene in chemical formula 1, and polysilsesquioxane in chemical formula 2. In chemical formula 1, R is selected from a substituted or unsubstituted C1-10 hydrocarbon group, a substituted or unsubstituted polar group, a substituted or unsubstituted aromatic group, a substituted or unsubstituted silane, and a substituted or unsubstituted halogen atom, n is an integer from 5,000-500,000. In chemical formula 2, X is one or more selected from a phenyl group, a vinyl group, an aryl group, and an acryl group, and n is an integer from 1-100,000.;COPYRIGHT KIPO 2013
机译:目的:提供一种环状烯烃基树脂以改善交联度,并显着改善物理性质,包括热膨胀系数。;组成:一种环状烯烃基树脂,其化学式1为聚降冰片烯,化学式为聚倍半硅氧烷2.在化学式1中,R 2选自取代或未取代的C 1-10烃基,取代或未取代的极性基团,取代或未取代的芳族基团,取代或未取代的硅烷以及取代或未取代的卤素原子,n是5,000-500,000之间的整数。在化学式2中,X是选自苯基,乙烯基,芳基和丙烯酰基中的一种或多种,​​并且n是1至100,000的整数。; COPYRIGHT KIPO 2013

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