METHOD AND APPARATUS FOR APPLYING A PERFORATION IN AN INITIALLY FLAT LAMINATED SUBSTRATE WHEREIN THE SUBSTRATE IS FLAT AFTER IRRADIATION AND A POSSIBLE POSTTREATMENT

摘要

The invention relates to a method and an apparatus for applying a perforation in a flat laminated substrate, such as a card having a thickness of at least 0.2 mm by irradiating the substrate by laser. When a perforation is applied by laser to such a card, it is often warped, leading to handling problems in the next processing steps. The invention may relate to a substrate which forms part of the booklet such as a passport. According to the invention the substrate is flat after the irradiation and a possible post treatment. According to a first embodiment the properties of the laser irradiation process are chosen such that the substrate is flat after the irradiation. According to a second embodiment the substrate is flattened after the irradiating by laser, for instance by heating the substrate.