首页> 外国专利> PACKING MATERIAL COMBINED WITH THE NON-FOAMED RESIN SHEET AND A MANUFACTURING METHOD THEREOF CAPABLE OF REDUCING COSTS AND TIME FOR PACKING ELECTRONIC ELEMENTS

PACKING MATERIAL COMBINED WITH THE NON-FOAMED RESIN SHEET AND A MANUFACTURING METHOD THEREOF CAPABLE OF REDUCING COSTS AND TIME FOR PACKING ELECTRONIC ELEMENTS

机译:结合非发泡树脂板的包装材料及其制造方法,可降低包装电子元件的成本和时间

摘要

PURPOSE: A packing material combined with the non-foamed resin sheet and a manufacturing method thereof are provided to reduce costs by attaching adhesion or intermediates and omitting surface embossing processes.;CONSTITUTION: A manufacturing method for a packing material combined with the non-foamed resin sheet is as follows. A plate type non-foamed resin sheet and a foamed resin sheet(20) are manufactured by synthetic resin. The non-foamed resin sheet and the foamed resin sheet are placed on a lower forming mold(30a). The non-foamed resin sheet and the foamed resin sheet are pressed by an upper forming mold and thermally fused.;COPYRIGHT KIPO 2013;[Reference numerals] (AA) Heating member
机译:目的:提供一种与非发泡树脂片材相结合的包装材料及其制造方法,以通过附着粘合剂或中间物并省略表面压花工艺来降低成本。组成:与非发泡树脂片材相结合的包装材料的制造方法树脂片如下。板状非发泡树脂片和发泡树脂片(20)由合成树脂制造。将未发泡树脂片和发泡树脂片放置在下部成型模具(30a)上。非发泡树脂片和发泡树脂片被上成型模具挤压并热熔合。; COPYRIGHT KIPO 2013; [参考数字](AA)加热元件

著录项

  • 公开/公告号KR20120122418A

    专利类型

  • 公开/公告日2012-11-07

    原文格式PDF

  • 申请/专利权人 PARK KYOO CHUL;

    申请/专利号KR20110040540

  • 发明设计人 PARK KYOO CHUL;

    申请日2011-04-29

  • 分类号B29C65/18;B29C65/02;B29C51/08;

  • 国家 KR

  • 入库时间 2022-08-21 17:08:49

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