LED WAFER DE-BONDER AND LED WAFER DE-BONDING METHOD

摘要

This invention further relates to a LED wafer Dibon, more particularly, to an LED wafer and the LED wafer relates to a device for removing the disc from the disc LED wafer bonded to each other by heating the assembly for supporting the LED wafer. The present invention, LED wafer and the wafer in that the LED to the LED wafer Dibon more disk assembly to separate the LED wafer is bonded by an adhesive to the support, the LED wafer to wafer assembly from the LED assembly is housed in the carrier assembly supply assembly for sequentially drawn; Separation unit which receives the heat from the LED assembly of the wafer assembly to remove the supply to the LED wafer and the LED wafer assembly disk; Wafer cleaner to clean the LED wafer received from the separation unit; Wafer discharge unit for receiving the LED wafers received from said wafer cleaners; And a disk discharge unit for storing the disc received from the separation unit; characterized in that it includes a LED wafer of the present invention is Dibon more, the effect of providing an LED wafer Dibon more that can be performed by automating the LED wafer debonding process of the LED wafer assembly and efficiently, LED wafer debonding method of the present invention, LED wafer has the effect of providing an efficient way to separate the assembly of LED wafers and disk.