NON-CYANIDE SILVER PLATING SOLUTION AND METHOD FOR FORMING PLATING USING IT

摘要

PURPOSE: Non-cyanide silver plating solution and a method for forming a silver plating layer using the same are provided to form a micro circuit since when silver plating solution is applied to a PCB, the resist of a circuit pattern is protected. CONSTITUTION: Non-cyanide silver plating solution comprises one of methane sulfonic acid silver, methane sulfonic acid, potassium iodide, iodotyrosine, tris(3-hydroxypropyl) phosphine and their mixture. The silver plating solution comprises one of 0.01~0.05M(mol/l) of methane sulfonic acid silver of 0.05~1.0M(mol/l), methane sulfonic acid of 0.2~0.3 M(mol/l), potassium iodide of 1.0~10.0 M(mol/l), iodotyrosine, tris(3-hydroxypropyl) phosphine and their mixture. The maximum pH of the silver plating solution is 1.