DEVICE FOR THE DOUBLE-SIDED PROCESSING OF FLAT WORKPIECES AND METHOD FOR THE SIMULTANEOUS DOUBLE-SIDED MATERIAL REMOVAL PROCESSING OF A PLURALITY OF SEMICONDUCTOR WAFERS

摘要

According to the invention, including the upper machining disk (4b) and the lower machining disk (4a), a double-sided processing device for flat workpieces (1), at least one of the upper machining disk (4b) and the lower machining disk (4a) one driving the at least one carrier disk having at least one cutout (25) for between the drive is possible, and the upper machining disk (4b) and the lower machining disk (4a) in the rotary, the at least one blood processing the workpiece (1) by (5) are machining gap 64 is formed disposed, at least one carrier disc (5) has a tooth 10 on its periphery, this value by the tooth-carrier discs and the internal gear wheel (7b) and an outer gear wheel (7a) or the inner pin ring and an outer pin ring and at least one rolling on the internal gear wheel (7b) and the outer gear wheel (7a) or the inner pin ring and an outer pin ring if that is set by the rotary of these a gear wheel, that is, pin ring (7a, 7b), each one at least of as having a plurality of gear configuration or pin configuration which engage additional teeth of the carrier disc (5) during rolling, at least one of the pin configuration is at least one axial direction of the carrier disc has at least one guide portion 48 to limit the movement of the edge (5), a guide part (48) is round the pin configuration between a second smaller diameter and the first diameter of pin configuration at least it is formed by one of the shoulder (肩部) (50) extending around the other guide portion (48) side (56, 58) of the at least one groove 15 extending around the circumference of the pin configuration that on both sides of the apparatus of the flat workpiece to be formed is provided by. ; Semiconductor wafers, processing the disk, the disk carrier, machining gap, the workpiece, a gear wheel, pin ring