首页> 外国专利> METHOD OF MANUFACTURING A POROUS RESIN SUBSTRATE HAVING PERFORATIONS AND METHOD OF MAKING A POROUS RESIN SUBSTRATE INCLUDING PERFORATIONS HAVING ELECTRICALLY CONDUCTIVE WALL FACES

METHOD OF MANUFACTURING A POROUS RESIN SUBSTRATE HAVING PERFORATIONS AND METHOD OF MAKING A POROUS RESIN SUBSTRATE INCLUDING PERFORATIONS HAVING ELECTRICALLY CONDUCTIVE WALL FACES

机译:具有孔的多孔树脂基质的制造方法以及具有穿孔的具有导电壁面的多孔树脂基质的制造方法

摘要

The present invention , in the porous resin base material formed of a resin material containing a fluorine-based polymer , penetrating in the thickness direction step 1 of forming at least one perforation ( ) to ; The inner wall surface of the perforation , by contacting an etching solution containing alkali metal Step 2 of etching treatment ; The deterioration caused by the etching process hwacheung , by contacting the compound or a solution having an oxidizing power , a method for manufacturing a perforated porous resin substrate 3 including the step of removing the alteration hwacheung . Is characterized by a method for producing a porous resin base material to the inside wall surface of the perforated conductive screen .
机译:本发明中,在由含有氟系聚合物的树脂材料形成的多孔质树脂基材中,在厚度方向上贯穿形成至少一个穿孔(a)的工序1。穿孔的内壁表面,通过接触含有碱金属的蚀刻液进行蚀刻处理的步骤2;通过使化合物或具有氧化能力的溶液接触而由蚀刻工艺引起的劣化,是一种制造多孔树脂多孔体基板3的方法,该方法包括去除所述变形现象的步骤。其特征在于一种在多孔导电筛的内壁表面上生产多孔树脂基材的方法。

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