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Silicon-Containing Film Forming Compsition, Silicon-Containing Film Serving as Etching Mask, Substrate Processing Intermediate, and Substrate Processing Method
Silicon-Containing Film Forming Compsition, Silicon-Containing Film Serving as Etching Mask, Substrate Processing Intermediate, and Substrate Processing Method
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机译:含硅膜形成组合物,用作蚀刻掩模的含硅膜,基板加工中间体和基板加工方法
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摘要
The present invention, in the lower layer film, and then a silicon formed containing film, a photoresist film thereon further on, the silicon-containing film forming composition used in the multi-layer resist method for performing etching of a single-layer intermediate film on a processed substrate relates to a hydrolyzable silane alone or a mixture of hydrolysis of silicon-containing composition for the etching mask of silicon-containing film formed for containing a polymer obtained by condensation of containing a silane compound having a silicon-bonded-, to silicon represented by the formula (1). ; Formula 1 ; R (6-m) Si 2 X m; (Wherein in the formula, R is a monovalent hydrocarbon group, X is an alkoxy group, an alkanoyloxy group or a halogen atom, m is a 6≥m≥3.) ; The compositions of the present invention may have a photoresist formed thereon to form a good pattern, high etch selectivity between the organic material is obtained. ; Etching mask, the silicon-containing film, a lower layer film, a photoresist
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机译:在本发明中,在下层膜中,然后在形成有硅的含膜中,进一步在其上形成光致抗蚀剂膜,在用于进行单层中间膜的蚀刻的多层抗蚀剂方法中使用的含硅成膜组合物用于处理的基材上的单独涉及可水解的硅烷或用于水解含硅膜的掩模的含硅组合物的水解混合物,所述含硅膜形成为包含通过缩合包含具有硅键合的硅烷化合物而获得的聚合物的聚合物。式(1)表示的硅。 ; <公式1>; R (6-m) Sub> Si 2 Sub> X m Sub>; (式中,R为一价烃基,X为烷氧基,烷酰氧基或卤原子,m为6≥m≥3。);本发明的组合物可以在其上形成光致抗蚀剂以形成良好的图案,在有机材料之间获得高的蚀刻选择性。 ;蚀刻掩模,含硅膜,下层膜,光致抗蚀剂
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