LOW SILVER SOLDER ALLOY AND SOLDER PASTE COMPOSITION

摘要

The low-silver solder alloy of the present invention is 0.05 to 2.0 mass% of silver, 1.0 mass% or less of copper, 3.0 mass% or less of antimony, 2.0 mass% or less of bismuth, 4.0 mass% or less of indium, 0.2 mass% or less of nickel, germanium 0.1 mass% or less, 0.5 mass% or less (but the said copper, antimony, bismuth, indium, nickel, germanium, and cobalt are each 0 mass%), and remainder consists of tin. According to the present invention, it is possible to provide a long-term reliable low-solder solder alloy having a low elongation, melting point, strength, and the like, and having high fatigue resistance (cold heat resistance fatigue resistance) while reducing the Ag content. .