首页> 外国专利> PROXIMITY EXPOSURE APPARATUS, METHOD FOR CONTROLLIPROXIMITY EXPOSURE APPARATUS, METHOD FOR CONTROLLING A SUBSTRATE TEMPERATURE IN THE PORXIMITY EXPOSUNG A SUBSTRATE TEMPERATURE IN THE PORXIMITY EXPOSURE APPARATUS AND METHOD OF MANUFACTURING A DISPLAYRE APPARATUS AND METHOD OF MANUFACTURING A DISPLAY PANEL SUBSTRATE PANEL SUBSTRATE

PROXIMITY EXPOSURE APPARATUS, METHOD FOR CONTROLLIPROXIMITY EXPOSURE APPARATUS, METHOD FOR CONTROLLING A SUBSTRATE TEMPERATURE IN THE PORXIMITY EXPOSUNG A SUBSTRATE TEMPERATURE IN THE PORXIMITY EXPOSURE APPARATUS AND METHOD OF MANUFACTURING A DISPLAYRE APPARATUS AND METHOD OF MANUFACTURING A DISPLAY PANEL SUBSTRATE PANEL SUBSTRATE

机译:邻近曝光装置,用于控制邻近曝光的装置的方法,用于控制邻近曝光中的基板温度的方法,用于制造邻近显示装置的显示温度的方法以及制造显示装置和制造方法的方法

摘要

The invention discloses a proximity exposure apparatus, method for controlling the substrate temperature and method of manufacturing a panel substrate, the temperature of the substrate is effectively controlled in the proximity exposure apparatus. The substrate (1) is supported by using a chuck (10) in a body chamber (30), a mask (2) is supported by using a mask holder (20) and the chuck (10) is moved by using the platform. The clean air after the temperature adjustment is supplied transversely to the body chamber (30), on one hand, a suction inlet (41) arranged below the chuck (10) moves with the chuck (10), on the other hand, the air introduced into the body chamber (30) from the suction inlet (410 is discharged out of the body chamber (30). the air flowing to the transverse direction, along the surface of the substrate (1), is introduced to the suction inlet (41) below the chuck (10), even though the mask (2) is arranged above the substrate (1) close to the substrate (1), the clean air after temperature adjustment is supplied to the surface of the substrate (1).
机译:本发明公开了一种接近曝光装置,控制基板温度的方法和面板基板的制造方法,在接近曝光装置中有效地控制了基板的温度。通过使用卡盘(10)将基片(1)支撑在体腔(30)中,通过使用掩模保持器(20)来支撑掩模(2),并且通过使用平台移动卡盘(10)。温度调节后的清洁空气被横向地供应到体腔(30),一方面,布置在卡盘(10)下方的吸入口(41)与卡盘(10)一起移动,另一方面,空气从吸入口(410)导入到主体腔室(30)中的空气从主体腔室(30)中排出,沿基板(1)的表面沿横向流动的空气被引入吸入口((另外,在卡盘(10)的下方的图41)中,即使在基板(1)的上方靠近基板(1)配置了掩模(2)的情况下,也将温度调整后的清洁空气供给至基板(1)的表面。

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