A Method for Recovering Tin and Silver from Lead Free Solder Ball Using Metal Solvent

摘要

PURPOSE: A method of recovering tin and silver from lead-free solder balls using a metal solvent is provided to enable silver and tin to be recovered at a high yield rate of 95% or higher. CONSTITUTION: A method of recovering tin and silver from lead-free solder balls using a metal solvent is as follows. Non-metal impurities having a high melting point and an organic volatile material are removed by the melting of the lead-free solder ball. The metal solvent is added to the lead-free solder balls, is melted, and is made into alloys. A firstly melted alloy material is cooled, stirred, and divided into silver-enriched alloy of a coagulated dross type and tin-silver-metal solvent alloy of a melted-metal type. The metal solvent is added to the tin-silver-metal solvent alloy of a melted-metal type is melted and made into alloys. A secondly melted alloy material is cooled, stirred, and divided into a silver-enriched alloy of a coagulated-dross type and tin-metal solvent alloy of a melted-metal type.