首页> 外国专利> STIFFENING PLATE ATTACHING APPARATUS FOR FLEXIBLE PRINTED CIRCUIT BOARD AND PUNCHING METHOD FOR STIFFENING PLATE

STIFFENING PLATE ATTACHING APPARATUS FOR FLEXIBLE PRINTED CIRCUIT BOARD AND PUNCHING METHOD FOR STIFFENING PLATE

机译:柔性印刷电路板的加固板固定装置及加固板的冲孔方法

摘要

The reinforcing plate attachment device for a flexible circuit board according to the present invention includes a reinforcing material supply device for supplying a reinforcing material, a die disposed on a conveying path of the reinforcing material supplied by the reinforcing material supply device, and a reinforcing material that is raised toward the die and supplied to the die. A punching press having a punch to punch the reinforcing plate, a linear feeding device disposed downstream of the punching press in the conveying path of the reinforcing material, an attachment head for absorbing the reinforcing plate punched by the punching press, and a reinforcing plate in a predetermined work area. And an attachment head transfer device for moving the attachment head to supply the flexible circuit board. The linear feeding device includes a fixed clamp device having a first clamper to hold the reinforcement, a movable clamp device having a second clamper to hold the reinforcement, and a movable clamp device to linearly move the second clamper along the conveying path of the reinforcement. And a linear drive connected to the. The reinforcing plate attachment device for a flexible circuit board according to the present invention is capable of precise feeding of the reinforcing material as compared with the feeding method of the reinforcing material using the conventional feeding roller by feeding the reinforcing material with the linear feeding device.
机译:根据本发明的用于柔性电路板的加强板附接装置包括:用于供给加强材料的加强材料供给装置;布置在由所述加强材料供给装置供给的所述加强材料的输送路径上的模具;以及加强材料。朝着模具升起并提供给模具。一种冲压机,其具有用于对加强板进行冲压的冲头,在加强材料的输送路径中布置在冲压机下游的线性进给装置,用于吸收由冲压机冲压的加强板的附接头以及其中的加强板。预定的工作区域。并且附接头转移装置用于移动附接头以供应柔性电路板。线性进给装置包括:固定夹具装置,其具有用于保持钢筋的第一夹持器;可移动夹具装置,其具有用于夹持钢筋的第二夹持器;以及可移动夹具装置,其使第二夹持器沿钢筋的输送路径线性地移动。与线性驱动器相连。与使用常规的进给辊的增强材料的进给方法相比,根据本发明的用于柔性电路板的增强板附接装置能够通过线性进给装置进给增强材料,从而精确地进给增强材料。

著录项

  • 公开/公告号KR101194816B1

    专利类型

  • 公开/公告日2012-10-25

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20110015677

  • 发明设计人 김세영;김천희;

    申请日2011-02-22

  • 分类号H05K13/02;H05K3/22;

  • 国家 KR

  • 入库时间 2022-08-21 17:07:17

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