首页> 外国专利> HEAT-PROOF ADDITIVES FOR A POLYMER RESIN COMPOSITION CONTAINING SPECIFIC THIO COMPOUND HAVING EXCELLENT HEAT STABILITY, AND A POLYMER RESIN COMPOSITION COMPRISING THE SAME

HEAT-PROOF ADDITIVES FOR A POLYMER RESIN COMPOSITION CONTAINING SPECIFIC THIO COMPOUND HAVING EXCELLENT HEAT STABILITY, AND A POLYMER RESIN COMPOSITION COMPRISING THE SAME

机译:包含具有优异热稳定性的特定硫醇化合物的高分子树脂组合物的耐热添加剂,以及包含相同成分的高分子树脂组合物

摘要

PURPOSE: A heat-proof additives for a polymer resin composition is provided to maintain thermal stability by using small amount and to be very environment-friendly because of volatility lower than existing heat-proof additives.;CONSTITUTION: A heat-proof additives a thio compound represented by chemical formula 1. In here, R1 is -Ch2SR2, R2 is a linear, branched or cyclic C5-16 alkyl group or C6-16 aromatic group, n is an integer satisfying 1=n=20. Number average molecular weight of the thio compound is 400-5,000. The polymer resin composition comprises 100.0 parts by weight of polymer resin, 0.01-5 parts by weight of the heat-proof additives. The polymer resin is one or more kinds selected from an ethylene polymer, a propylene polymer, a styrene polymer, a urethane polymer, a styrene-acrylonitrile copolymer, and an acrylonitrile-butadiene-styrene block copolymer.;COPYRIGHT KIPO 2013
机译:用途:提供一种用于聚合物树脂组合物的耐热添加剂,以保持少量的热稳定性,并且由于挥发性低于现有的耐热添加剂,因此对环境非常友好。用化学式1表示的化合物。在此,R 1为-Ch 2 SR 2,R 2为直链,支链或环状的C 5-16烷基或C 6-16芳族基团,n为满足1≤n≤20的整数。硫代化合物的数均分子量为400-5,000。聚合物树脂组合物包含100.0重量份的聚合物树脂,0.01-5重量份的耐热添加剂。聚合物树脂是选自乙烯聚合物,丙烯聚合物,苯乙烯聚合物,氨基甲酸酯聚合物,苯乙烯-丙烯腈共聚物和丙烯腈-丁二烯-苯乙烯嵌段共聚物中的一种或多种。COPYRIGHTKIPO 2013

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