SOLUTION FOR LASER-INDUCED METALLIZATION OF DIELECTRICS AND METHOD OF LASER-INDUCED METALLIZATION OF DIELECTRICS WITH ITS USE

摘要

FIELD: electricity.;SUBSTANCE: method involves preparation of copper plating solution, irradiation of solution by means of argon laser beam focused at 5-10 mcm spot at dielectric-solution boundary line, with simultaneous movement of mechanised table with dielectric plate at the speed of 0.01 mm/s at power of laser radiation, which penetrates into the solution of 100 mW to 450 mW. As copper plating solution there used is solution containing 0.01 M CuCl₂, 0.011 M Trilon B, 0.05 M NaOH, 0.05 M - 0.1 M HCHO, 0.003 M parabenzokinone (C₅H₄O₂), which is taken in the quantity of not less than 0.1 ml/cm². Irradiation is performed at temperature of 15-25°C; the above solution is used for metallisation of dielectric plate located vertically to direction of laser beam.;EFFECT: invention allows metallising dielectric surface without using any phototemplate and external current sources at room temperature so that continuous copper tracks can be obtained, which correspond to boards of accuracy class equal to 5 and higher.;2 cl, 4 dwg