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A process for the preparation of a copper alloy for a connecting piece and by the method available copper alloy

机译:一种用于连接件的铜合金的制备方法,以及通过该方法可获得的铜合金

摘要

A process for the preparation of a copper alloy for a connecting piece, comprising the steps of:Melting of an alloy, the 23 – 28 w -% zn and 0,3 – 1,8 w -% sn, wherein the following equation (1) is met and the remainder copper and unavoidable impurities are 6,0 ≦ 0,25X + y ≦ 8,5 (1)wherein x is the added amount of zn (w -%) and y is the added amount of sn (w -%) is,continuous casting of the melt, wherein the melt from the liquidus to 600°C. at a rate of at least 50°C. / min is cooled,the subsequent hot rolling of the resulting mold at an elevated temperature of 900°C or lower,Repeating of the method of the cold rolling and of the hardening in a temperature range from 300 to 650°C, until the hardened in such a rolled strip a crystal grain size of not more than 25 μm, andfurthermore, the incubator of a cold-rolling operation with a reduction in the thickness of at least 30% and the low temperature curing at 450°C. or..
机译:一种制备用于连接件的铜合金的方法,包括以下步骤:合金,23 – 28 w-%zn和0.3–1.8 w-%sn的合金熔融,其中以下方程式( 1)被满足,剩余的铜和不可避免的杂质为 <?inline?> 6,0≤0,25X + y≤8,5(1) 其中x为zn(w-%)和y的添加量是sn(w-%)的添加量,连续浇铸熔体,其中熔体从液相线到600℃。以至少50°C的速度。冷却/分钟,随后在900℃或更低的高温下对所得模具进行热轧,在300至650℃的温度范围内重复冷轧和硬化的方法,直至硬化在这样的轧制带材中,晶粒尺寸不大于25μm,并且,其是具有至少30%的厚度减小并且在450℃下低温固化的冷轧操作的恒温箱。要么..

著录项

  • 公开/公告号DE10065735B4

    专利类型

  • 公开/公告日2012-08-16

    原文格式PDF

  • 申请/专利权人 DOWA MINING CO. LTD.;

    申请/专利号DE2000165735

  • 发明设计人 AKIRA SUGAWARA;LE LING;KAZUKI HATAKEYAMA;

    申请日2000-12-29

  • 分类号C22C9/04;H01B1/02;H01R13/04;H01R12/50;C22F1/08;

  • 国家 DE

  • 入库时间 2022-08-21 17:05:48

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