Thermoplastic molding composition, useful e.g. to produce circuit board, comprises polyamide, flame retardant comprising phosphinic acid salt, nitrogen-containing flame retardant and optionally zinc salt, layered silicate and additive

摘要

Thermoplastic molding composition (I) comprises (a) 10-99.5 wt.% of a polyamide, (b) 0.45-25 wt.% of a flame retardant combination comprising at least one phosphinic acid salt, a nitrogen-containing flame retardants and optionally a zinc salt, (c) 0.05-5 wt.% of an unmodified layered silicate, and (d) 0-70 wt.% of additives.