Flat heat pipe for cooling fin that is utilized for cooling electronic component, has capillary structural layer arranged in side of inner space of continuous rotating pipe wall, where side of inner space faces pipe wall

摘要

The heat pipe has a copper pipe structure (21) flatly formed with a continuous rotating pipe wall (211). An inner space (212) of the pipe wall is closed such that a top wall and a bottom wall lie opposite to each other. A sintered support layer (22) i.e. capillary structure, comprises multiple rods (221) that are vertically arranged between the top wall and the bottom wall such that both ends of the top wall and the bottom wall are connected with each other. A capillary structural layer (23) is arranged in a side of the inner space facing the pipe wall. The capillary structure and the capillary structural layer are manufactured by sintering powder, fibers and foams. An independent claim is also included for a method for manufacturing a flat heat pipe.