Producing connection point and/or connection region on and/or in surface of substrate, comprises removing material to obtain periodic deep structure on and/or in surface by laser interference, and partially filling deep structure

摘要

Producing a connection point and/or a connection region on and/or in a surface of a substrate, comprises carrying out material removal leading to a periodic deep structure (2) on and/or in the surface of the substrate by laser interference, and at least partially filling the deep structure introduced in the surface of the substrate with an appropriate intermediary material (3) for material-fit connection. Independent claims are also included for: (1) a substrate (1) with a joint and/or a connection region produced in at least one of its surface; and (2) a component with the substrate and an element disposed with the substrate or laminating material associated with the substrate, preferably a lamination layer produced by the above mentioned method.