Heat pump has refrigerant circuit, where compressor, expansion device, refrigerant-to-air heat exchanger and refrigerant-to-fluid heat exchanger are arranged

摘要

The heat pump has a refrigerant circuit (3), where a compressor (4), an expansion device (5), a refrigerant-air-heat exchanger (1) and a refrigerant-fluid-heat exchanger (2) are arranged. The sorbent (17) for an intensive heat transfer stand in close contact with upper surfaces of the refrigerant-air-heat exchanger, where the upper surfaces is over flown by air (8). The sorbent is a hygroscopic salt solution in a carrier or zeolite or silica gel. An independent claim is also included for a method for drying a chamber.