Sensor arrangement, has mold-housing comprising access port provided with sensitive region and sense element, and stress decoupling structure formed in sense element, where sense element is formed between mold-housing and sensitive region

摘要

The arrangement has a sense element (10) arranged in a layer structure on semiconductor substrate (2). A terminal portion (12) and a sensitive region (11) are arranged in the semiconductor substrate. The sense element is mounted on a carrier. A mold-housing comprises an access port provided with the sensitive region and the sense element. The sense element is formed between the mold-housing and the sensitive region. A stress decoupling structure (13) is formed in the sense element.