Method for applying structure in surface of silicon wafer, involves applying mask base material to surface of solar cell, coating selected pattern with plunger, and contacting liquid etching medium with etching mask

摘要

The method involves applying a mask base material to a surface of a solar cell e.g. silicon wafer. A pattern selected according to a desired structure is impregnated (3) on the base material using a plunger. The base material is cured so that an etching mask is obtained. A liquid etching medium i.e. aqueous solution, is brought into contact with the etching mask to obtain the solar cell with a structured surface, where the mask does not have holes in a region of the surface to be structured. The base material is comprised of a network former i.e. sol-gel precursor. An independent claim is also included for a solar cell comprising a structured surface.