Cooling structure for electronic component e.g. transistor, has heat distributor whose side surfaces are rounded or tapered so that side surfaces of heat distributor are partially arranged on base portion

摘要

The cooling structure (1) has recess that is formed in a base portion (2). A heat distributor (3) is arranged in the recess portion. The electronic component is connected to the main surface (5) of the heat distributor. The side surfaces (4-4) of the heat distributor are rounded or tapered so that side surfaces of the heat distributor are partially arranged on the base portion. The cooling slats are formed in a base surface of the heat distributor. The base portion of is made of aluminum, copper, aluminum alloy or copper alloy.