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Method for manufacturing high frequency electromagnetic wave transmission line that is coupled to e.g. semiconductor, involves utilizing air-filled cavities for attenuation of air or vacuum, where cavities are produced by covering
Method for manufacturing high frequency electromagnetic wave transmission line that is coupled to e.g. semiconductor, involves utilizing air-filled cavities for attenuation of air or vacuum, where cavities are produced by covering
The method involves utilizing air-filled cavities (4) for attenuation of air or vacuum for loss-free coupling of components using high frequency signals, where the cavities are produced by a covering (2) using an additive process. The covering is made of electrically conductive material, and walls of the cavities are metallized such that a wave guide for electromagnetic waves is produced. Lateral walls and a base of the cavities are metallized, and end faces of the cavities are non-metallized such that a metallic conductor is integrated into the wave guide.
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