首页> 外国专利> Method for manufacturing high frequency electromagnetic wave transmission line that is coupled to e.g. semiconductor, involves utilizing air-filled cavities for attenuation of air or vacuum, where cavities are produced by covering

Method for manufacturing high frequency electromagnetic wave transmission line that is coupled to e.g. semiconductor, involves utilizing air-filled cavities for attenuation of air or vacuum, where cavities are produced by covering

机译:高频电磁波传输线的制造方法,该高频电磁波传输线耦合到例如半导体,涉及利用充气的空腔来衰减空气或真空,其中空腔通过覆盖产生

摘要

The method involves utilizing air-filled cavities (4) for attenuation of air or vacuum for loss-free coupling of components using high frequency signals, where the cavities are produced by a covering (2) using an additive process. The covering is made of electrically conductive material, and walls of the cavities are metallized such that a wave guide for electromagnetic waves is produced. Lateral walls and a base of the cavities are metallized, and end faces of the cavities are non-metallized such that a metallic conductor is integrated into the wave guide.
机译:该方法包括利用充气的空腔(4)来衰减空气或真空,以利用高频信号来使部件无损耗地耦合,其中,空腔是通过覆盖层(2)利用附加工艺来产生的。覆盖物由导电材料制成,并且空腔的壁被金属化,从而产生用于电磁波的波导。空腔的侧壁和底部被金属化,并且空腔的端面未被金属化,使得金属导体被集成到波导中。

著录项

  • 公开/公告号DE102010053047A1

    专利类型

  • 公开/公告日2012-06-06

    原文格式PDF

  • 申请/专利权人 GOETZEN REINER;

    申请/专利号DE20101053047

  • 发明设计人 GOETZEN REINER;

    申请日2010-12-02

  • 分类号H01L23/66;H01L23/48;H01P11/00;H01R9/05;H01Q13/00;H01P5/00;

  • 国家 DE

  • 入库时间 2022-08-21 17:05:13

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