首页> 外国专利> Channeling vacuum process systems, comprises feeding air in a lock chamber of the vacuum process system until pressure is equally large within and outside of the lock chamber, and opening the lock chamber to atmosphere

Channeling vacuum process systems, comprises feeding air in a lock chamber of the vacuum process system until pressure is equally large within and outside of the lock chamber, and opening the lock chamber to atmosphere

机译:引导真空处理系统的步骤包括:向真空处理系统的锁定室中馈入空气,直到锁定室内部和外部的压力相等,并将锁定室向大气开放

摘要

The method comprises feeding air in a lock chamber of a vacuum process system until the pressure is equally large within and outside of the lock chamber, where air admitted in the lock chamber has a lower water content with respect to the ambient air, opening the lock chamber to the atmosphere, introducing a substrate along a transportation path through an aperture in the lock chamber, where the substrate is passed into the vacuum chamber, and again feeding air into the lock chamber even after reaching the pressure prevailing outside the lock chamber and after opening the lock chamber. The method comprises feeding air in a lock chamber of a vacuum process system until the pressure is equally large within and outside of the lock chamber, where air admitted in the lock chamber has a lower water content with respect to the ambient air, opening the lock chamber to the atmosphere, introducing a substrate along a transportation path through an aperture in the lock chamber, where the substrate is passed into the vacuum chamber, again feeding air into the lock chamber even after reaching the pressure prevailing outside the lock chamber and after opening the lock chamber, where air has a lower water content relative to the ambient air, and discharging air from the lock chamber from the time of reaching the atmospheric pressure in the lock chamber. The volume flow of the fed air is reduced after reaching the atmospheric pressure. Air is fed in partial volume flows at two locations along the transportation path of the substrate and air is omitted in the partial volume flows at two locations along the transportation path of the substrate. The partial volumetric flow decreases in the transportation path of the substrate. A sum of all partial volumetric flows of fed air is larger than the sum of all partial volumetric flows of omitted air.
机译:该方法包括在真空处理系统的锁定室中馈入空气,直到该锁定室之内和之外的压力相等,此时,进入该锁定室的空气相对于周围空气具有较低的水含量,打开该锁定装置室进入大气,沿着传送路径通过锁定室中的孔引入基板,基板进入真空室,然后在达到锁定室外部的主要压力之后和之后再次向锁定室供气。打开锁室。该方法包括在真空处理系统的锁定室中馈入空气,直到该锁定室之内和之外的压力相等,此时,进入该锁定室的空气相对于周围空气具有较低的水含量,打开该锁定装置室进入大气,沿着传送路径通过锁定室中的孔引入基板,基板进入真空室,即使在达到锁定室外部的主要压力并打开后,再次向锁定室供气锁定室,其中空气相对于周围空气具有较低的水含量,并且从达到锁定室中的大气压时起就从锁定室排出空气。达到大气压力后,送入空气的体积流量减小。在沿着基板的输送路径的两个位置处以部分体积流进给空气,并且在沿着基板的输送路径的两个位置处以部分体积流进去空气。局部体积流量在基板的输送路径中减小。送入空气的所有部分体积流量的总和大于被忽略空气的所有部分体积流量的总和。

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