Circuit board for e.g. MOSFET in hybrid car, has support structure comprising recess for receiving current conductor, where current conductor is formed as mold part and arranged in recess of support structure

摘要

The board (1) has a support structure comprising a recess (3) for receiving a current conductor (4). The current conductor is formed as mold part and arranged in the recess of the support structure. The current conductor is formed as a solid flat conductor with a rectangular section. The current conductor conducts current with current values above 500 amperes. The current conductor is projected via a side boundary of the support structure. The current conductor is arranged such that current flow is directed vertically to a side surface.