A package - on - package - approach sensor module which an infrared transmitter package and an infrared receiver package, it is shown. The approach sensor module can be a finished, an infrared transmitter package and a finished, an infrared receiver package, the on a quad flat pack no - lead (qfn) - a lead frame, which can be provided with an ir - blocking masses housing is formed, arranged. A lower surface of the qfn - said lead frame can be etched and with the ir - blocking mass be covered, in order to provide a locking function between the qfn - a lead frame and the ir - blocking to provide compositions housing.
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