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Housing - to - housing - approach sensor module

机译:外壳到外壳的接近传感器模块

摘要

A package - on - package - approach sensor module which an infrared transmitter package and an infrared receiver package, it is shown. The approach sensor module can be a finished, an infrared transmitter package and a finished, an infrared receiver package, the on a quad flat pack no - lead (qfn) - a lead frame, which can be provided with an ir - blocking masses housing is formed, arranged. A lower surface of the qfn - said lead frame can be etched and with the ir - blocking mass be covered, in order to provide a locking function between the qfn - a lead frame and the ir - blocking to provide compositions housing.
机译:显示了一个封装式封装接近传感器模块,其中显示了一个红外发射器封装和一个红外接收器封装。接近传感器模块可以是成品的红外发射器包装,也可以是成品的红外接收器包装,在四方扁平包装上-引线(qfn)-引线框架,可以配备ir-阻挡质量壳体形成,排列。 qfn-所述引线框架的下表面可以被蚀刻并且ir-阻挡块被覆盖,以便在qfn-引线框架和ir-阻挡之间提供锁定功能以提供组合物的壳体。

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